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TUESDAY, June 8, 2004, 10:30 AM - 12:00 PM | Room: 6B
TOPIC AREA:  POWER

   SESSION 2
  Special Session: HOT Leakage
  Chair: Massoud Pedram - Univ. of Southern California, Los Angeles, CA
  Organizers: Lei He

  Leakage has a growing importance due to technology scaling, and for better control thermal dependency must be considered to better control leakage. This session surveys state-of-the-art leakage reduction at device, circuit and system levels, and poses challenges and opportunities for further CAD development.

    2.1   Circuit and Device Optimizations with Electrothermal Coupling in Scaled Technologies
  Speaker(s): Arman Vassighi - Intel Corp., Kitchener, Ontario, Canada
  Author(s): Arman Vassighi - Intel Corp., Kitchener, Ontario, Canada
Ali Keshavarzi - Intel Corp, Hillsboro, OR
Siva Narendra - Intel Corp., Hillsboro, OR
Seri Lee - Intel Corp., Hillsboro, OR
Yibin Ye - Intel Corp., Hillsboro, OR
Vivek De - Intel Corp., Hillsboro, OR
    2.2Leakage Estimation and Leakage Control for Nano-Scale CMOS Circuits
  Speaker(s): Kaushik Roy - Purdue Univ., West Lafayette, IN
  Author(s): Kaushik Roy - Purdue Univ., West Lafayette, IN
Saibal Mukhopadhyay - Univ. Waterloo, Waterloo, ON, Canada
    2.3System Level Leakage Reduction Considering the Interdependency between Temperature and Leakage
  Speaker(s): Lei He - Univ. of California, Los Angeles, CA
  Author(s): Lei He - Univ. of California, Los Angeles, CA
Weiping Liao - Univ. of California, Los Angeles, CA
Mircea R. Stan - Univ. of Virginia, Charlottesville, VA