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| TUESDAY, June 8, 2004, 10:30 AM - 12:00 PM | Room: 6B |
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TOPIC AREA: POWER
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SESSION 2
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| Special Session: HOT Leakage
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| Chair: Massoud Pedram - Univ. of Southern California, Los Angeles, CA
| | Organizers: Lei He
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| Leakage has a growing importance due to technology scaling, and for better control thermal dependency must be considered to better control leakage. This session surveys state-of-the-art leakage reduction at device, circuit and system levels, and poses challenges and opportunities for further CAD development.
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| 2.1 |
Circuit and Device Optimizations with Electrothermal Coupling in Scaled Technologies
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| Speaker(s): | Arman Vassighi - Intel Corp., Kitchener, Ontario, Canada
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| Author(s): | Arman Vassighi - Intel Corp., Kitchener, Ontario, Canada
Ali Keshavarzi - Intel Corp, Hillsboro, OR
Siva Narendra - Intel Corp., Hillsboro, OR
Seri Lee - Intel Corp., Hillsboro, OR
Yibin Ye - Intel Corp., Hillsboro, OR
Vivek De - Intel Corp., Hillsboro, OR
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| 2.2 | Leakage Estimation and Leakage Control for Nano-Scale CMOS Circuits |
| Speaker(s): | Kaushik Roy - Purdue Univ., West Lafayette, IN
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| Author(s): | Kaushik Roy - Purdue Univ., West Lafayette, IN
Saibal Mukhopadhyay - Univ. Waterloo, Waterloo, ON, Canada
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| 2.3 | System Level Leakage Reduction Considering the Interdependency between Temperature and Leakage |
| Speaker(s): | Lei He - Univ. of California, Los Angeles, CA
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| Author(s): | Lei He - Univ. of California, Los Angeles, CA
Weiping Liao - Univ. of California, Los Angeles, CA
Mircea R. Stan - Univ. of Virginia, Charlottesville, VA
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